Product Name:
Multi functional universal chip mounter H806 plus
Advantage description:
- Multi camera CMDS high speed imaging technology based on FPGA, with multiple sensors taking pictures in full synchronization
- Real time image acquisitio with high frame rate and megapixel resolution
- Complete accurate visual identification of various standard and special-shaped parts
- The chip head adopts small volume, ultra quiet linear motor control technology
Application industry:
SMT electronic material patch, 3C,Aerospace, automotive electronics, home appliances, lighting, 3C consumer electronics, semiconductor
To realize multi-functional full-image high speed and high precision mounting, its high speed and high efficiency to cope with small components (01005, 0201-3216, micro transistor), at the same time can meet the range of medium and large components (SOP, QFP, BGA) multi-function mounting
Localization rate of parts and components:95%
Product function:
•01 Identification of various complex components
•02 High precision visual recognition system
•03 Real-time flying shot technology
•04 Simple and easy to operate interface
•05 Ultra quiet linear motor control technology
Technical specifications:
•Positioning mode: flying vision + stage vision
•Number of shaft rods :
•1 arm * 8 nozzles (Spacing 21mm)
•Pick and place accuracy: XY:±0 . 035mm
•Pick and place speed :CPH:18000
•Corresponding Components:01005~40*35mm,H:15mm,SOP,QFP,BGA etc,
•PCB Dimension:
*Minimum:length(50mm)*width(50mm), H:0~5mm
*Maximum: standard length(500mm)* width(450mm), H:0~5mm
•Number of feeder : 8mm -120 stands
•Power / Air pressure:380V/50HZ;0.5~0.7Mpa
•Rated Power:6.5KW
•Machine weight:1800Kg
•Overall Dimension:1950(L)*1400(W)*1370(H); ground anchor (H): 1500mm
Product feature:
•accurate
•stable
•efficient
•convenient and fast
Image of machine:
Audited Supplier 
){kind=link}