MOJE surface mount technology assembly process FTH101 chip mounter
Component range: Size: 0201-40 * 40mm Height: 15mm
Max Component loading type: 48+48 (bilateral feeding), (converted according to standard 8mm), supporting gas electric Feida
Installation speed: 18000 CPH (IPC9850 standard)/H beam, 6+1
installation head Accuracy: ± 0.035mm
Process capability: CPK ≥ 1.33 Support BGA mounting
Throwing rate: ≤ 0.3%
High precision core components are the key factor in ensuring mounting accuracy, achieving U-level accuracy.MOJE The self-developed high-precision mounting head can significantly improve precision manufacturing accuracy (with maximum parallelism and verticality up to 0.05mm) and greatly enhance product stability.
Undertake 2 provincial and municipal science and technology plan projects 100+intellectual property rights,
with 16+authorized invention patents SMT key technology
won the Guangzhou Science and Technology Progress Award Undertake the research and development plan for key areas of high-end equipment in Guangdong Province in 2022
research and industrialization of high-speed and high-precision intelligent mounting equipment for advanced semiconductors
Undertake the 2022 Guangzhou Artificial Intelligence Major Technology Project
Research and Application of 3D Visual Inspection System for SMT Production Line Based on Deep Learning